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Solder Paste—Wetting Test

1.0 Scope Determine the ability of a solder paste to wet an oxidized copper surface and to qualitatively examine the amount of spatter of the solder paste during reflow. 2.0 Applicable Documents None IPC-TM-650 Test Methods Manual 2.4.43 Solder Paste—Solder Ball Test 3.0 Test Specimen 7.6 cm x 2.5 cm x 0.8 mm specimen of 1 ounce oxygen-free high conductivity (OFHC) copper. 4.0 Equipment ...

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A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. The ball grid array, chip-scale package, and flip chip packages generally use solder balls. Underfill. After the solder balls are used to attach an integrated circuit chip to a PCB, often the remaining air gap between them is underfilled with epoxy. ...

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